规格书 |
5175475 CHAMP Series I Appl Spec |
文档 |
5-5175475-3 Statement of Compliance RoHS 2 Statement 5-5175475-3.stp 5-5175475-3.igs 5-5175475-3.pdf |
Rohs | Lead free / RoHS Compliant |
RoHS信息 | 5-5175475-3 Statement of Compliance |
三维模型 | 5-5175475-3.pdf |
标准包装 | 900 |
Connector 风格 | Outer Shroud Contacts |
Connector 型 | Receptacle |
位置数 | 30 |
行数 | 2 |
安装类型 | Through Hole |
终止 | Solder |
法兰特点 | - |
型 | Board to Board, High Density |
特点 | Board Lock |
触点表面涂层 | Gold |
触点涂层厚度 | 30µin (0.76µm) |
类型 | SCSI |
性别 | RCP |
间距 | 2.54 mm |
触点数 | 30 |
端接方式 | Solder |
安装 | Through Hole |
身体上的取向 | Straight |
标准包装 | Trays |
PCB极化 | Without |
PCB安装角度 | Vertical |
固定支脚材质 | Brass |
外壳材料 | Nylon |
PCB安装方式 | Thru Hole |
位置数 | 30 |
简介 | Standard |
Lead Free Solder Processes | Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder c |
产品系列 | Series I |
间距(mm (中) ) | 1.27 [0.050] |
品牌 | AMP |
产品类型 | Connector |
RoHSELV合规性 | RoHS compliant, ELV compliant |
PCB保持力特性 | Yes |
连接器类型 | High Density (HD) |
外壳温度等级 | Standard |
触点区域镀层材料 | Gold (30) |
PCB保持力的方法 | Boardlock(s) |
壳体防火等级 | UL 94V-0 |
封底 | Without |
颜色 | Black |
固定支脚镀层 | Tin over Nickel |
用于 | Board To Board Applications |
触点材料 | Phosphor Bronze |
RoHSELV符合记录 | Always was RoHS compliant |
终止(焊接)长度(mm (英寸) ) | 3.10 [0.122] |
产品特点 | Board Lock |
安装类型 | Through Hole |
触点表面涂层 | Gold |
行数 | 2 |
端子 | Solder |
Contact Finish Thickness | 30µin (0.76µm) |
连接器类型 | Outer Shroud Contacts |
RoHS指令 | Lead free / RoHS Compliant |
工厂包装数量 | 150 |
产品种类 | Board to Board & Mezzanine Connectors |
RoHS | RoHS Compliant |
标准包装 | 150 |
mating | 3-5175472-3 1734100-3 5-5175473-3 |
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